Source: https://tendernation.io/opportunities/01a140ac-f6d0-7288-8008-ee65e3b7a0b5/finland-miscellaneous-general-and-special-purpose-machinery-semi-automatic-w

closed FI open procedure Suitable for SMEs

# Miscellaneous general and special-purpose machinery – Semi-Automatic Wafer Grinder

[VTT Technical Research Centre of Finland Ltd](https://tendernation.io/buyers/vtt-technical-research-centre-of-finland-ltd)

Estimated value

Not stated

Published

20 Oct 2025

Deadline

Closed

17 Nov 2025

## Who can bid

- Buyer says suitable for SMEs

    The buyer ticked “suitable for SMEs” on the notice. Anyone can still bid.
- Open procedure

    Anyone can submit a full tender; there is no shortlisting stage.

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## About this tender

The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new. The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.

## CPV classification

Miscellaneous general and special-purpose machinery

Source

Tenders Electronic Daily (EU) · Notice 689551-2025

[View official notice](https://ted.europa.eu/en/notice/689551-2025)

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