Source: https://tendernation.io/opportunities/01a13bbe-a318-7014-a02e-5e2ddec59354/silicon-wafers-for-test-chips

awarded GB direct award procedure

# Silicon Wafers for Test Chips

[The Open University](https://tendernation.io/buyers/the-open-university)

Estimated value

Not stated

Published

15 Aug 2025

Deadline

Rolling deadline

## About this tender

As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.

Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.

Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.

Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.

### Cost

Phase 1: £220,000

Phase 2: £250,000

Phase 3: £350,00

Total: £820,000

Source

Find a Tender (UK) · Notice ocds-h6vhtk-055960-2025-08-15T15:27:18+01:00

[View official notice](https://www.find-tender.service.gov.uk/Notice/ocds-h6vhtk-055960-2025-08-15T15:27:18+01:00)

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